Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

The main joining process of the electronic industry is still soldering with different alloys Sn. This work studied relationship between Sn whisker growth and corrosion resistance 99Sn0.3Ag0.7Cu–TiO2/ZnO (0.25wt%) composite solder in a corrosive environment via scanning electron microscopy focused ion beam techniques. test showed that application TiO2 ZnO nano-particles almost totally suppressed improved compared to reference 99Sn0.3Ag0.7Cu alloy. microstructural analysis alloy volumetric increase corroded β-Sn grains resulted local mechanical stress joints, which was released by development. However, increased grain boundary fraction segregation boundaries relatively uniform compact protective oxide layer at boundaries. formation SnOx, this, corrosion-induced growth.